When 2 flat surfaces come in contact with each other, such as a transistor package and heatsink, the average contact area is only 2%, the remaining area is an air gap. Air is a very poor thermal conductor and so restricts the flow of heat from the heat generating component to the heatsink.

To get the best performance from a heatsink and so keep the operating temperature of the component to a minimum the air gap must be filled with a thermally conductive medium. Warth Kool-Pads, with their soft surfaces , are designed to eliminate these air gaps and give the lowest possible thermal resistance between a heat generating component and its heatsink, whilst ensuring electrical isolation is maintained where required. This in turn lowers the operating temperature of the component improving its reliability and extending its life.

There are several factors that can determine the most appropriate thermal interface material, such as overall thermal resistance, voltage isolation requirements, thickness and softness of the material.

Use the following links to determine which material is most appropriate for your application, or use the fast-track links on the side bar to go immediately to the material of choice.

OR FIND IT FAST HERE

Laird Technologies has a name for high quality service and intelligent solutions to the most complex of thermal issues.

All these products can be converted to any shape necessary, and with the minimum of tooling charges and leadtimes.

Laird Technologies has worked to provide a complete range of thermal solutions to their customers. To complement our extensive range of thermal interface materials, we also supply a complete spectrum of heatsinks, both preformed and extruded, clips and fittings. The range of heatsinks extends from standard component types, such as the TO-220 and TO-3 styles to large scale CPU and IC units, equipped with fans and attachment clips.
In addition to our range of standard products, we can also offer a comprehensive custom part service, where unique and specific heatsinks can be built to suit any requirement.

In addition to board level heatsinks, we can also provide a variety of bonded fin types that provide double the cooling surface relative to the same size of standard finned parts.

We also provide liquid cold plates and heat exchangers as part of our range.