Kool-Pads®  KA150-2AC  
Microprocessor thermal interface pads. Constructed from highly conductive foil with thermally conductive adhesive on both sides. Eliminates the need for clips or clamps.

Thermal resistance 0.49°C/Watt

Temperature range -20 to +155°C

Thickness 0.16mm

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Pad Profiles
BQ insulating bushes
CM20 - NA / AC
TP1500
TP2100
KK071-AC
K177 - NA / AC
K180 - NA / AC
K200 - NA / AC
K228 - NA / AC
K230 - NA / AC
K381 - NA
KA150-2AC
KF - Koolform
KFL - Koolflo
KP adhesives and greases
KPS
KTG
KTP
PK 17 - NA
PK 23 - NA
THER-T
THER - 05, 07, 10, 15, 20
TSC transistor clips Thread Lock
TSC transistor clips Spring Lock
ZOA-30